Title : 
Resistive switching of SiOX with one diode-one resistor nanopillar architecture fabricated via nanosphere lithography
         
        
            Author : 
Li Ji ; Yao-Feng Chang ; Fowler, B. ; Ying-Chen Chen ; Tsung-Ming Tsai ; Kuan-Chang Chang ; Min-Chen Chen ; Ting-Chang Chang ; Sze, Simon M. ; Yu, E.T. ; Lee, Jong Chul
         
        
            Author_Institution : 
Microelectron. Res. Center, Univ. of Texas at Austin, Austin, TX, USA
         
        
        
        
        
        
            Abstract : 
Resistive random access memories (ReRAM) has attracted tremendous attention as a promising candidate for non-volatile memory. ReRAM can be classified into two categories: unipolar and bipolar memory. The advantage of unipolar memory is that it can be integrated into simple 1D-1R architecture with low static power consumption and constrained sneak-path issue. This is because unipolar memory does not require opposite voltage polarities for on/off switching [1]. SiOx has long been used as gate dielectrics for MOSFET and recently proved to be an active unipolar ReRAM material [2, 3]. Here we report SiOx-based 1D-1R high density nanopillar ReRAM via nanosphere lithography.
         
        
            Keywords : 
nanolithography; random-access storage; silicon compounds; 1D-1R architecture; MOSFET; ReRAM; SiOx; active unipolar ReRAM material; bipolar memory; constrained sneak-path issue; gate dielectrics; high-density nanopillar ReRAM; low-static power consumption; nanosphere lithography; nonvolatile memory; on-off switching; one-diode one-resistor nanopillar architecture; resistive random access memories; resistive switching; silicon oxide; unipolar memory; Architecture; Buildings; Educational institutions; Lithography; Resistors; Road transportation; Switches;
         
        
        
        
            Conference_Titel : 
Device Research Conference (DRC), 2014 72nd Annual
         
        
            Conference_Location : 
Santa Barbara, CA
         
        
            Print_ISBN : 
978-1-4799-5405-6
         
        
        
            DOI : 
10.1109/DRC.2014.6872388