Half-Thru de-embedding method for millimeter-wave and sub-millimeter-wave integrated circuits

An accurate de-embedding method for millimeter-wave and sub-millimeter-wave integrated circuits is presented. In this “Half-Thru” de-embedding method, the pad-interconnects parasitics effects are modeled as a Half-Thru structure from both parts of the device under test. Several de-embedding methods over millimeter and sub-millimeter wave frequencies are compared in integrated technology by considering S-CPW transmission lines as device under test. From these comparisons we propose an effective way to de-embed transmission lines. The S-CPW transmission line model and results are obtained from full-wave electromagnetic simulations in BiCMOS 55-nm technology.