• DocumentCode
    1779169
  • Title

    Growth temperature effects on graded InxAl1−xAs/GaAs buffer for metamorphic In0.70Ga0.30As/In0.53Al0.47As planar transistor on Ge-on-insulator(GeOI) substrate

  • Author

    Wicaksono, Satrio ; Kian Hua Tan ; Wan Khai Loke ; Soon Fatt Yoon ; Ivana ; Subramanian, Sivaraman ; Owen, Man Hon Samuel ; Yee-Chia Yeo

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2014
  • fDate
    2-4 June 2014
  • Firstpage
    61
  • Lastpage
    62
  • Abstract
    This paper aims to investigate the effect of substrate temperature on molecular beam epitaxy-grown InxAl1-xAs graded buffer layer. Atomic force microscopy, cross-sectional transmission electron microscopy, and secondary ion mass spectroscopy are used for wafer characterization. TEM images are used to estimate the threading dislocation density in the wafer. To demonstrate the feasibility of this growth method for device integration, HEMT and HBT are also fabricated.
  • Keywords
    III-V semiconductors; aluminium compounds; atomic force microscopy; buffer layers; dislocation density; gallium arsenide; heterojunction bipolar transistors; high electron mobility transistors; indium compounds; molecular beam epitaxial growth; secondary ion mass spectra; semiconductor epitaxial layers; semiconductor growth; transmission electron microscopy; Ge; Ge-on-insulator substrate; HBT; HEMT; In0.70Ga0.30As-In0.53Al0.47As; InxAl1-xAs-GaAs; TEM; atomic force microscopy; cross-sectional transmission electron microscopy; graded buffer layer; molecular beam epitaxy; planar transistor; secondary ion mass spectroscopy; substrate temperature; threading dislocation density; wafer characterization; Atomic layer deposition; Epitaxial growth; Logic gates; Substrates; Transistors; Transmission electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon-Germanium Technology and Device Meeting (ISTDM), 2014 7th International
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4799-5427-8
  • Type

    conf

  • DOI
    10.1109/ISTDM.2014.6874626
  • Filename
    6874626