Title :
Revealing the high room and low temperature mobilities of 2D holes in a strained Ge quantum well heterostructures grown on a standard Si(001) substrate
Author :
Myronov, M. ; Morrison, Cherrelle ; Halpin, John ; Rhead, S. ; Foronda, J. ; Leadley, David
Author_Institution :
Dept. of Phys., Univ. of Warwick, Coventry, UK
Abstract :
We report an extremely high 2DHG mobility of 4500 cm2V-1s-1 and 777000 cm2V-1s-1 at 293 and 0.333 K, respectively, in a compressively strained Ge QW grown by industrial type RP-CVD on a standard Si(001) substrate. The obtained 2DHG mobility is substantially higher than those reported so far and in structures grown by research type epitaxial growth techniques, i.e. SS-MBE and LEPE-CVD. Also, the room and low temperature hole mobilities obtained are the highest not only among the group-IV Si and Ge based semiconductors, but also among p-type III-V and II-VI ones. These results demonstrate the very high quality of the strained Ge QW epilayers grown by RP-CVD and the huge potential for further applications of such materials in modern and future CMOS, p-MOSFET and p-MODFET electronic devices. The 2DHG mobility is already sufficiently high to fabricate sub-100 nm electronic devices and demonstrate ballistic transport therein at or around room temperature.
Keywords :
chemical vapour deposition; elemental semiconductors; germanium; hole mobility; semiconductor epitaxial layers; semiconductor growth; semiconductor heterojunctions; semiconductor quantum wells; 2D hole mobility; 2DHG mobility; Ge; LEPE-CVD; SS-MBE; Si; Si(001) substrate; ballistic transport; electronic devices; epitaxial growth techniques; industrial typ RP-CVD; low temperature mobility; p-MODFET; p-MOSFET; p-type II-VI; p-type III-V; strained Ge quantum well heterostructure; temperature 0.333 K; temperature 293 K; temperature 293 K to 298 K; Charge carrier density; Hall effect; Semiconductor device measurement; Silicon; Substrates; Temperature measurement; Two dimensional hole gas;
Conference_Titel :
Silicon-Germanium Technology and Device Meeting (ISTDM), 2014 7th International
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-5427-8
DOI :
10.1109/ISTDM.2014.6874628