DocumentCode
1779192
Title
Strained Ge0.96 Sn0.04 P-channel MOSFETs with in situ low temperature Si2 H6 surface passivation
Author
Yan Liu ; Jing Yan ; Genquan Han ; Hongjuan Wang ; Mingshan Liu ; Chunfu Zhang ; Buwen Cheng ; Yue Hao
Author_Institution
Key Lab. of Optoelectron. Technol. & Syst. of the Educ. Minist. of China, Chongqing Univ., Chongqing, China
fYear
2014
fDate
2-4 June 2014
Firstpage
107
Lastpage
108
Abstract
We developed process flow for GeSn pMOSFET fabrication with in situ low temperature Si2H6 passivation module. High performance Ge0.96Sn0.04 pMOSFETs were fabricated. At a Qmv of 6×1012 cm-2, a 24% enhancement in μeff is demonstrated in Ge0.96Sn0.04 pMOSFETs compared to Ge control.
Keywords
MOSFET; germanium compounds; hole mobility; passivation; silicon compounds; Ge0.96Sn0.04-Si2H6; effective hole mobility; in situ low temperature surface passivation; strained p-channel MOSFET; MOSFET; Passivation;
fLanguage
English
Publisher
ieee
Conference_Titel
Silicon-Germanium Technology and Device Meeting (ISTDM), 2014 7th International
Conference_Location
Singapore
Print_ISBN
978-1-4799-5427-8
Type
conf
DOI
10.1109/ISTDM.2014.6874637
Filename
6874637
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