Title :
Development of a low-cost packaging for MEMS pressure sensors
Author :
Conte Ayala Penalver, Diego ; Furlan, Humber ; Amorim Fraga, Mariana
Author_Institution :
Centro Paula Souza (CEETEPS), Mestrado Profissional em Gestao e Tecnol. em Sist. Produtivos, Sao Paulo, Brazil
Abstract :
Considerable research efforts have been devoted to the development of MEMS sensor packaging based on different material types (ceramic, plastic and metal). In this work, we describe the design, fabrication and test of a metal packaging with high reliability and low cost. The novelty of our research is on the packaging assembly by mechanical interference replacing the expensive plasma welding process that is used commonly in the development of traditional metal packaging.
Keywords :
assembling; electronics packaging; interference; microfabrication; microsensors; pressure sensors; reliability; MEMS pressure sensor; ceramic material; mechanical interference; metal material; metal packaging assembly; plasma welding process; plastic material; reliability; Assembly; Interference; Mechanical sensors; Micromechanical devices; Packaging; Stress; MEMS; low-cost; packaging; pressure sensors;
Conference_Titel :
Sensors (IBERSENSOR), 2014 IEEE 9th Ibero-American Congress on
Conference_Location :
Bogota
Print_ISBN :
978-1-4799-6835-0
DOI :
10.1109/IBERSENSOR.2014.6995521
