DocumentCode :
1779923
Title :
LDPE/EVA nanocomposite lifetime studies
Author :
Guastavino, F. ; Della Giovanna, L. ; Torello, E. ; Garcia, Narciso ; Tiemblo Magro, P.
Author_Institution :
Dept. of Electr., Electron. Telecommun. Eng. & Naval Archit., Univ. of Genova, Genoa, Italy
fYear :
2014
fDate :
19-22 Oct. 2014
Firstpage :
784
Lastpage :
787
Abstract :
In this work thermoplastic polymeric blends have been investigated. Such blends are based on low density polyethylene mixed in 80:20 (wt. %/wt. %) ratio with ethylene vinyl acetate. The nanocomposites has been obtained by adding montmorillonite and silica as fillers. The aim is to identify a new class of insulating materials for medium voltage equipment that could substitute the conventional ones characterized by high life cycle costs. The materials have been prepared by twin screw compounding following an optimized procedure that leads to good quality of the blends. The uniformity of the blends have been verified by means of chemical-physical analysis. Suitable specimens have been prepared by hot compression molding setting temperature, pressure and process time parameters. In this way a good thickness uniformity of the specimens has been obtained in order to perform electrical tests and to characterize the prepared blends. The electrical behavior has been investigated by means of electrical strength and electrical aging tests to trace lifetime curves.
Keywords :
ageing; compression moulding; insulation testing; nanocomposites; polyethylene insulation; EVA nanocomposite lifetime studies; LDPE nanocomposite lifetime studies; chemical-physical analysis; electrical aging tests; electrical strength; hot compression molding setting temperature; insulating materials; low density polyethylene; medium voltage equipment; montmorillonite; thermoplastic polymeric blends; twin screw compounding; Aging; Dielectrics; Electric breakdown; Insulation; Plastics; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location :
Des Moines, IA
Type :
conf
DOI :
10.1109/CEIDP.2014.6995736
Filename :
6995736
Link To Document :
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