• DocumentCode
    1779988
  • Title

    The effect of exfoliation on the breakdown strength of polystyrene boron nitride composites

  • Author

    Ayoob, R. ; Andritsch, T. ; Vaughan, A.S. ; Meng, Yongqing

  • Author_Institution
    Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    675
  • Lastpage
    678
  • Abstract
    Research on polymer nanocomposites promises to create a new class of materials with enhanced dielectric properties. This paper reports on the study of polystyrene systems filled with hexagonal boron nitride (BN) nanoparticles. The polymer nanocomposite materials were produced using a solvent blending procedure, where some of the materials were produced using dichloromethane (DCM) as the solvent and others using isopropyl alcohol (IPA). The breakdown strength was measured at different loading levels; the breakdown strength was found to decrease at the 5 wt% loading level, but increased again with 10 wt% and higher loadings of BN. The effect of exfoliation by solvent choice and sonication on the breakdown strength was investigated; sonication in IPA produced the best results. However, micrographs obtained from the scanning electron microscope show no apparent change of the dispersion of BN in the sonicated systems with the different solvents.
  • Keywords
    boron compounds; electric breakdown; nanocomposites; organic insulating materials; scanning electron microscopy; BN nanoparticles; DCM; IPA; breakdown strength; dichloromethane; exfoliation; hexagonal boron nitride nanoparticles; isopropyl alcohol; polymer nanocomposite materials; polystyrene boron nitride composites; polystyrene systems; scanning electron microscope; solvent blending procedure; Boron; Dispersion; Electric breakdown; Loading; Polymers; Solvents;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
  • Conference_Location
    Des Moines, IA
  • Type

    conf

  • DOI
    10.1109/CEIDP.2014.6995768
  • Filename
    6995768