DocumentCode
1780024
Title
Space charge behaviours in polyethylene under combined AC and DC electric fields
Author
Zhou, Changle ; Chen, Gang
Author_Institution
Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
fYear
2014
fDate
19-22 Oct. 2014
Firstpage
848
Lastpage
851
Abstract
Polyethylene has been one of the widely studied polymeric insulation materials. One of the major issues related to polymeric materials is the easy formation of space charge which may cause electric field enhancement. In this paper, a numerical simulation based on a bipolar charge injection/transport model is used to obtain characteristics of space charge in polyethylene under the combined AC and DC high voltage at room temperature. The bipolar charge injection/transport model, which is widely used in HVDC space charge simulation, is applied in this combined condition. The overall applied voltage, consisted of root mean square (RMS) values of 50 Hz AC voltage and DC voltage, is kept the same, while the DC component has been varied from 0 to 1. The simulated charge distributions present notable differences when DC offset is added compared with pure AC conditions. Besides, these differences become more significant when the offset ratio is increased. The total positive and negative charge amounts are calculated respectively by integrating the charge in the material, and a curve of net charge amount changing along with time is obtained.
Keywords
carrier mobility; polymers; space charge; AC electric fields; AC high voltage; DC electric fields; DC high voltage; HVDC space charge simulation; bipolar charge injection-transport model; carrier mobility; charge distribution; electric field enhancement; numerical simulation; polyethylene; polymeric insulation material; root mean square values; space charge behaviour; temperature 293 K to 298 K; Electric fields; Insulation; Polyethylene; Space charge; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location
Des Moines, IA
Type
conf
DOI
10.1109/CEIDP.2014.6995787
Filename
6995787
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