• DocumentCode
    1780059
  • Title

    On interfaces and the DC breakdown performance of polyethylene/silica nanocomposites

  • Author

    Lau, K.Y. ; Vaughan, A.S. ; Chen, Gang ; Hosier, I.L. ; Holt, A.F.

  • Author_Institution
    Inst. of High Voltage & High Current, Univ. Teknol. Malaysia, Skudai, Malaysia
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    679
  • Lastpage
    682
  • Abstract
    In this paper, the mechanisms underpinning the concept of filler functionalization in nanodielectrics was studied through the use of silane coupling agents containing different aliphatic chain lengths. The results agree with our previous findings that the use of nanosilica functionalized using long silane chains enhances the DC breakdown performance of the resulting nanocomposites, but the optimized breakdown strength depends not only on the silane chain length - other factors such as the degree of filler functionalization are also believed to be influential. At present, few systematic studies of this area have been undertaken with a view to understanding the mechanisms underpinning the concept of filler functionalization in nanodielectrics, and this work demonstrates a promising way to tailor the properties of polyethylene-based nanodielectrics via silanes with different alkyl chain lengths. Several key questions concerning nanodielectric research are also raised.
  • Keywords
    dielectric materials; electric breakdown; glass; nanocomposites; polyethylene insulation; DC Breakdown Performance; DC breakdown performance enhancement; aliphatic chain lengths; filler functionalization concept; polyethylene nanocomposites; polyethylene-based nanodielectrics; silane chain length; silane coupling agents; silica nanocomposites; Couplings; Dielectrics; Electric breakdown; Nanocomposites; Plastics; Polyethylene; Space charge;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
  • Conference_Location
    Des Moines, IA
  • Type

    conf

  • DOI
    10.1109/CEIDP.2014.6995805
  • Filename
    6995805