DocumentCode
1780108
Title
Barium titanate and the dielectric response of polystyrene-based composites
Author
Boorman, O. ; Hosier, I.L. ; Praeger, M. ; Torah, Russel ; Vaughan, A.S. ; Andritsch, T. ; Swingler, S.G. ; Topham, J.
Author_Institution
Electron. & Comput. Sci., Univ. of Southampton, Southampton, UK
fYear
2014
fDate
19-22 Oct. 2014
Firstpage
707
Lastpage
710
Abstract
Barium titanate (BaTiO3) is characterized by real permittivity values as high as 10,000, depending upon structure. Consequently, in this work, this material was chosen to serve as a high permittivity filler for polystyrene (PS) based composites. In order to determine the influence of particle dimensions on the permittivity of the composite, the filler size was varied by means of ball milling, from the as-received microscopic filler size, to the mesoscopic and nanometric range. Filler size was measured by scanning electron microscopy (SEM). To explore the influence of fillgrade and particle size on the effective permittivity, a range of different composites was produced and subjected to dielectric spectroscopy. The results obtained were compared with effective medium theories. Since neither the Maxwell Garnet nor Bruggeman equations were able to reproduce the dependency of permittivity on composition seen experimentally, the Lichtenecker Rother equation was chosen and found to provide a good fit for the experimental data.
Keywords
ball milling; barium compounds; composite insulating materials; dielectric materials; particle size measurement; permittivity; polymer insulators; scanning electron microscopy; spectroscopy; BaTiO3; Bruggeman equations; Lichtenecker-Rother equation; Maxwell Garnet equations; SEM; ball milling; barium titanate; dielectric response; dielectric spectroscopy; fill grade; microscopic filler size; particle size; permittivity values; polystyrene-based composites; scanning electron microscopy; Ball milling; Dielectrics; Dispersion; Loading; Permittivity; Polymers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location
Des Moines, IA
Type
conf
DOI
10.1109/CEIDP.2014.6995830
Filename
6995830
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