DocumentCode
1780120
Title
The influences of proportion of flexible epoxy resin on dielectric properties
Author
Hua Feng ; Zong-ren Peng ; Xin Ning ; Jia-long Wang ; Peng Liu ; Zi-hao Guo
Author_Institution
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fYear
2014
fDate
19-22 Oct. 2014
Firstpage
320
Lastpage
323
Abstract
Epoxy resin has been widely used in dry-type insulation application, such as dry-type bushings. This study focuwes on the epoxy formulation system effect on the dielectric properties of epoxy resin. With methyl hexahydrophthalic anhydride as curing agent, we made the specimens which were mixed epoxy resin and flexible epoxy resin in different weight. Because of the proportion of flexible epoxy resin, the composite epoxy resin specimens have different glass transition temperature. Experimental results demonstrate that the glass transition temperature decreases linearly as proportion of flexible epoxy resin rises. Glass transition temperature has a considerable effect on dielectric properties of epoxy resin.
Keywords
curing; dielectric properties; epoxy insulation; glass transition; resins; composite epoxy resin specimens; curing agent; dielectric properties; dry-type insulation application; epoxy formulation system effect; flexible epoxy resin; glass transition temperature; methyl hexahydrophthalic anhydride; mixed epoxy resin; Conductivity; Dielectrics; Temperature; dielectric properties; epoxy resin; glass transition temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location
Des Moines, IA
Type
conf
DOI
10.1109/CEIDP.2014.6995837
Filename
6995837
Link To Document