DocumentCode
1780206
Title
Electrical treeing in LDPE-EVA blend based nanocomposites
Author
Guastavino, F. ; Della Giovanna, L. ; Torello, E. ; Hoyos, M. ; Tiemblo Magro, P.
Author_Institution
Dept. of Electr., Univ. of Genova, Genoa, Italy
fYear
2014
fDate
19-22 Oct. 2014
Firstpage
780
Lastpage
783
Abstract
In this work thermoplastic polymeric blends based on low density polyethylene (LDPE) and ethylene vinyl acetate (EVA) have been investigated. The blends have been obtained mixing together portions of 80% of LDPE and 20% of EVA adding montmorillonite and silica as fillers to get different nanocomposite materials with different nanofillers amounts: chosen percentage were 3% and 7% by weight. The aim of this research program was to identify the behaviour of these nanocomposite blends when subjected to electrical treeing and to identify the effect of the interface polymer matrix - nanofiller and the effect of the blends chemical-physical structure on the tree growth. The materials have been prepared by twin screw compounding following an optimized procedure leading to obtain good quality blends. The homogeneity of the compound has been verified by means of chemical-physical analysis. Suitable specimens have been realized by hot compression moulding. Electrical needle-plane tests have been performed in order to evidence the performance of the nanocomposite blends against the treeing growths.
Keywords
compression moulding; nanocomposites; polyethylene insulation; polymer blends; trees (electrical); LDPE-EVA blend based nanocomposites; blends chemical-physical structure; electrical needle-plane tests; electrical treeing; ethylene vinyl acetate; hot compression moulding; interface polymer matrix; low density polyethylene; montmorillonite; nanocomposite blends; nanocomposite materials; nanofiller; thermoplastic polymeric blends; tree growth; twin screw compounding; Dielectrics; Electrodes; Insulation; Nanocomposites; Needles; Polymers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location
Des Moines, IA
Type
conf
DOI
10.1109/CEIDP.2014.6995879
Filename
6995879
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