• DocumentCode
    1781963
  • Title

    Generalized Debye model for PCB dielectrics and conductors

  • Author

    Engin, A. Ege ; Kozachenko, Eva

  • Author_Institution
    Dept. of Electr. & Comput. Eng., San Diego State Univ., San Diego, CA, USA
  • fYear
    2014
  • fDate
    12-16 May 2014
  • Firstpage
    97
  • Lastpage
    100
  • Abstract
    Electromagnetic (EM) simulators are commonly used for electromagnetic compatibility and signal integrity (SI) analysis of printed circuit boards (PCB). The accuracy of such analysis depends on the models used for PCB dielectrics and conductors. These models should be broadband and preserve the physical properties of the materials, such as causality and passivity. One such model for dielectrics is the Debye model. Conductors have typically been modeled using a simple surface impedance formula, which is accurate for smooth conductors and small skin depth. With the evolution of high-speed designs, surface roughness loss has also become increasingly important for signal integrity of PCB interconnects. In this paper, we propose a Debye-like model for conductors possibly having rough surfaces. The advantages of a Debye model are its flexibility for arbitrary variation of surface roughness; guaranteed passivity in SI analysis; and availability of an equivalent circuit representation.
  • Keywords
    conductors (electric); electromagnetic compatibility; equivalent circuits; printed circuit interconnections; skin effect; surface roughness; PCB conductors; PCB dielectrics; PCB interconnects; electromagnetic compatibility; electromagnetic simulators; equivalent circuit representation; generalized Debye model; printed circuit boards; signal integrity analysis; simple surface impedance formula; small skin depth; smooth conductors; surface roughness loss; Conductors; Impedance; Integrated circuit modeling; Rough surfaces; Surface impedance; Surface roughness; Vectors; Debye model; skin effect; surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International Symposium on
  • Conference_Location
    Tokyo
  • Type

    conf

  • Filename
    6997081