DocumentCode :
1782165
Title :
Safety assessment of AIMDs under MRI exposure: Tier3 vs. Tier4 evaluation of local RF-induced heating
Author :
Cabot, Eugenia ; Zastrow, Earl ; Kuster, Niels
Author_Institution :
IT´IS Found., Zurich, Switzerland
fYear :
2014
fDate :
12-16 May 2014
Firstpage :
237
Lastpage :
240
Abstract :
Patients with active implantable medical devices (AIMDs) are generally excluded from magnetic resonance (MR) diagnostics because interference of the AIMD with MR-induced radiofrequency (RF) fields can lead to hazardous localized heating in the surrounding tissues. In this work, we report the safety assessment of a generic device performed according to tier 3 and 4 guidelines in Technical Specification 10974. For tier 3, local tissue heating was obtained by applying RF fields, obtained numerically in vivo in human models exposed to MRI coils, to a transfer function of the device. For tier 4, a validated model of the generic device was implanted in anatomical human models exposed to the RF of MRI coils, and full-wave computational electromagnetic simulations were performed. A comparison of the two methods is made.
Keywords :
biological tissues; biomedical MRI; biomedical equipment; biothermics; coils; prosthetics; radiofrequency heating; AIMDs; MR-induced radiofrequency fields; MRI coils; MRI exposure; Technical Specification 10974; Tier3 evaluation; Tier4 evaluation; active implantable medical devices; anatomical human models; full-wave computational electromagnetic simulations; generic device; hazardous localized heating; local RF-induced heating; local tissue heating; magnetic resonance diagnostics; safety assessment; surrounding tissues; transfer function; Computational modeling; Implants; In vivo; Magnetic resonance imaging; Numerical models; Safety; Trajectory; MRI; Medical Devices; Safety;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International Symposium on
Conference_Location :
Tokyo
Type :
conf
Filename :
6997181
Link To Document :
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