DocumentCode
1782182
Title
Analysis of power dissipation and temperature rise of an inductive link for retinal implants
Author
Ng, David C. ; Skafidas, Efstratios
Author_Institution
Victoria Res. Lab., NICTA, Melbourne, VIC, Australia
fYear
2014
fDate
12-16 May 2014
Firstpage
434
Lastpage
437
Abstract
Retinal implants operating with inductive coils for wireless power and data transmission are being developed to help restore vision to the blind. In this work, we analyze temperature increase in the tissue surrounding a retinal implant due to resistive heating of the coils. Using principles of heat transfer and power dissipation data, we estimate temperature rise in the tissue. From our analysis, we found that heat generation and convection are the most important factors in determining temperature rise near the transmit coil. Near the receive coil, heat generation and location of the coil have the biggest impact on maximum temperature rise. Finally, if the implant chip is located near highly vascularised regions of the retina, temperature rise at the retina is negligible. This work is expected to benefit future development of wireless power and data telemetry for retinal implants.
Keywords
biomedical telemetry; biothermics; coils; convection; data communication equipment; eye; prosthetics; vision; blind; convection; data telemetry; data transmission; heat generation; heat transfer; implant chip; inductive coils; inductive link; maximum temperature rise; power dissipation data; receive coil; resistive heating; retinal implants; transmit coil; vascularised regions; vision restoration; wireless power; Coils; Equations; Heat transfer; Heating; Implants; Retina; Temperature; heat transfer; retinal implant; temperature rise;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International Symposium on
Conference_Location
Tokyo
Type
conf
Filename
6997190
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