DocumentCode
17833
Title
Conduction Mechanisms and Breakdown Characteristics of
-Doped 

Author
Knebel, S. ; Schroeder, Ulrik ; Dayu Zhou ; Mikolajick, Thomas ; Krautheim, Gunter
Author_Institution
Nanoelectronic Mater. Lab. gGmbH, Dresden, Germany
Volume
14
Issue
1
fYear
2014
fDate
Mar-14
Firstpage
154
Lastpage
160
Abstract
This paper presents the results of I-V and constant-voltage-stress measurements on symmetrical dielectric ZrO2/Al2O3/ZrO2 film stacks of different thicknesses. The films were grown by atomic layer deposition and structured into cylindrical metal-insulator-metal capacitors. The temperature-dependent leakage characteristics and time-dependent dielectric breakdown behaviors were investigated. A correlation was found between the structural composition, the defect density, and the conduction mechanism.
Keywords
MIM devices; aluminium compounds; atomic layer deposition; dielectric materials; electric breakdown; stress measurement; voltage measurement; zirconium compounds; Al2O3:ZrO2; I-V measurements; ZrO2-Al2O3-ZrO2; atomic layer deposition; breakdown characteristics; conduction mechanisms; constant-voltage-stress measurements; cylindrical metal-insulator-metal capacitors; dielectric breakdown; high-k dielectrics; three-dimensional stacked metal-insulator-metal capacitors; Aluminum oxide; Dielectrics; Electrodes; Films; Permittivity; Temperature measurement; Tin; $hbox{ZrO}_{2}$ ; High-$k$ ; leakage model; metal–insulator–metal (MIM) capacitor; reliability;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2012.2204058
Filename
6215028
Link To Document