• DocumentCode
    17833
  • Title

    Conduction Mechanisms and Breakdown Characteristics of \\hbox {Al}_{2}\\hbox {O}_{3} -Doped \\hbox {ZrO}_{2}

  • Author

    Knebel, S. ; Schroeder, Ulrik ; Dayu Zhou ; Mikolajick, Thomas ; Krautheim, Gunter

  • Author_Institution
    Nanoelectronic Mater. Lab. gGmbH, Dresden, Germany
  • Volume
    14
  • Issue
    1
  • fYear
    2014
  • fDate
    Mar-14
  • Firstpage
    154
  • Lastpage
    160
  • Abstract
    This paper presents the results of I-V and constant-voltage-stress measurements on symmetrical dielectric ZrO2/Al2O3/ZrO2 film stacks of different thicknesses. The films were grown by atomic layer deposition and structured into cylindrical metal-insulator-metal capacitors. The temperature-dependent leakage characteristics and time-dependent dielectric breakdown behaviors were investigated. A correlation was found between the structural composition, the defect density, and the conduction mechanism.
  • Keywords
    MIM devices; aluminium compounds; atomic layer deposition; dielectric materials; electric breakdown; stress measurement; voltage measurement; zirconium compounds; Al2O3:ZrO2; I-V measurements; ZrO2-Al2O3-ZrO2; atomic layer deposition; breakdown characteristics; conduction mechanisms; constant-voltage-stress measurements; cylindrical metal-insulator-metal capacitors; dielectric breakdown; high-k dielectrics; three-dimensional stacked metal-insulator-metal capacitors; Aluminum oxide; Dielectrics; Electrodes; Films; Permittivity; Temperature measurement; Tin; $hbox{ZrO}_{2}$; High-$k$; leakage model; metal–insulator–metal (MIM) capacitor; reliability;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2012.2204058
  • Filename
    6215028