DocumentCode :
1783436
Title :
GaN-HEMT nonlinear modeling of single-ended and Doherty high-power amplifiers
Author :
Hajji, Rached ; Poulton, Matthew ; Crittenden, D.B. ; Gengler, Jeff ; Xia, Peter
Author_Institution :
TRIQUINT Semicond. Inc., Richardson, TX, USA
fYear :
2014
fDate :
6-7 Oct. 2014
Firstpage :
373
Lastpage :
376
Abstract :
A large-signal model for 120W high power packaged pre-matched transistor utilizing TriQuint´s TQGaN25HV HEMT technology is presented. It is composed of an array of unit-cell nonlinear EEHEMT models representing the high power GaN transistor die and EM based models for the input/output pre-matching circuits relaying the transistor die pads to the package leads. This model offers accurate small-signal and large-signal performance prediction at the package leads reference plane, as well as, when used in 50Ω matched evaluation boards of 120W single-ended and 240W Doherty PA´s. The model is validated in S-band against measured data, offering good prediction of Doherty PA key parameters, backoff efficiency and saturated peak power.
Keywords :
III-V semiconductors; electronics packaging; gallium compounds; high electron mobility transistors; power amplifiers; semiconductor device models; wide band gap semiconductors; Doherty high power amplifiers; GaN; HEMT nonlinear modeling; TriQuint TQGaN25HV HEMT technology; high power packaged prematched transistor; large signal model; package leads; prematching circuits; single ended; temperature 120 C; temperature 240 C; transistor die pads; Data models; Frequency measurement; Impedance; Integrated circuit modeling; Load modeling; Predictive models; Transistors; Doherty; GaN-on-SiC HEMT; Pre-matched Packaged Nonlinear Models; Single-ended;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
European Microwave Integrated Circuit Conference (EuMIC), 2014 9th
Conference_Location :
Rome
Type :
conf
DOI :
10.1109/EuMIC.2014.6997870
Filename :
6997870
Link To Document :
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