Surface acoustic wave propagation characteristics of ScAlN/diamond structure with buried electrode

Author

Qiao-zhen Zhang ; Tao Han ; Wei-biao Wang ; Hashimoto, Ken-ya ; Jing Chen

Author_Institution

Dept. of Electron. Inf. & Electr. Eng., Shanghai Jiao Tong Univ., Shanghai, China

fYear

2014

fDate

Oct. 30 2014-Nov. 2 2014

Firstpage

271

Lastpage

274

Abstract

In this paper, a 3D Finite Element model (FEM) of a surface acoustic wave (SAW) resonator consists of a piezoelectric thin film ScAlN /diamond layered structure with buried interdigital electrodes (IDT) was performed and analyzed using commercial software COMSOL Multiphysics, FEM software. We have done investigation on SAW propagation characteristics on the layered structures for different thickness of ScAlN film and electrode as well as different electrode materials. Simulation results showed that the maximum electromechanical coupling factor K_max² achieved up to be 14.35% for Rayleigh mode and 10% for Sezawa mode, which is more than two times larger than the previous report (5.48%). This work is useful for design of SAW devices with wideband and high frequency.

Keywords

III-V semiconductors; aluminium compounds; diamond; electromechanical effects; finite element analysis; piezoelectric thin films; scandium compounds; surface acoustic wave resonators; surface acoustic waves; wide band gap semiconductors; 3D finite element model; COMSOL multiphysics commercial software; FEM software; Rayleigh mode; SAW propagation; ScAlN-C; Sezawa mode; buried interdigital electrodes; electromechanical coupling factor; piezoelectric thin film layered structure; surface acoustic wave propagation characteristics; surface acoustic wave resonator; Diamonds; Electrodes; Materials; Resonant frequency; Surface acoustic wave devices; Surface acoustic waves; FEM; SAW; layered structure; propagation characteristics;

fLanguage

English

Publisher

ieee

Conference_Titel

Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA), 2014 Symposium on

Conference_Location

Beijing

Print_ISBN

978-1-4799-6424-6

Type

conf

DOI

10.1109/SPAWDA.2014.6998578

Filename

6998578