DocumentCode
1784243
Title
Equivalent circuit for unloaded triple-layer piezoelectric cantilevers
Author
Li-jiao Gong ; Bin Ju ; Guang-jun Xiao ; Zhi-hua Feng
Author_Institution
Dept. of Precision Machinery & Precision Instrum., Univ. of Sci. & Technol. of China, Hefei, China
fYear
2014
fDate
Oct. 30 2014-Nov. 2 2014
Firstpage
345
Lastpage
350
Abstract
Triple-layer piezoelectric composite cantilevers possess good electromechanical conversion behavior with characteristics suitable for diverse applications, especially at low frequency. Thus, the use of such cantilevers has been extensively attempted in fabricating piezoelectric devices. This study reports on the accurate determination methods for the equivalent circuit parameters derived from the electrical admittance of triple-layer piezoelectric cantilevers. Analytical expressions of electrical admittance are presented. The lumped parameters available for the Van Dyke equivalent circuit model are also derived from expressions for the electrical admittance of piezoelectric sandwich structures with two piezoelectric layers. Finally, prototype devices based on the triple-layer piezoelectric cantilever are constructed and tested. Results from the experiments show good agreement with the analytical models.
Keywords
cantilevers; composite materials; equivalent circuits; lumped parameter networks; piezoelectric devices; piezoelectricity; sandwich structures; Van Dyke equivalent circuit model; analytical expressions; electrical admittance; electromechanical conversion behavior; equivalent circuit parameters; lumped parameters; piezoelectric devices; piezoelectric sandwich structures; triple-layer piezoelectric composite cantilevers; unloaded triple-layer piezoelectric cantilevers; Admittance; Equations; Equivalent circuits; Frequency measurement; Integrated circuit modeling; Mathematical model; Resonant frequency; Bimorph; Electrical admittance; Equivalent circuit; Triple-layer piezoelectric cantilever (TLPC);
fLanguage
English
Publisher
ieee
Conference_Titel
Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA), 2014 Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4799-6424-6
Type
conf
DOI
10.1109/SPAWDA.2014.6998596
Filename
6998596
Link To Document