DocumentCode
1784426
Title
Modelling heating effects due to current crowding in ZnO nanowires with end-bonded metal contacts
Author
Kryvchenkova, O. ; Kalna, Karol ; Cobley, R.J.
Author_Institution
Coll. of Eng., Multidiscipl. Nanotechnol. Centre, Swansea, UK
fYear
2014
fDate
20-22 Oct. 2014
Firstpage
1
Lastpage
4
Abstract
A full 3D model for the simulation of carrier transport, self-consistently coupled with thermal transport, has been developed for free-standing ZnO nanowires with Schottky contacts. The model predicts a complex distribution of the current density through the metal-semiconductor interface with a high current density area around the edge of the Schottky contact away from the contact centre. This high current density would result in increased Joule heating at the contact edge of the free standing ZnO nanowire leading to local temperature breakdown at the contact. Degradation with increasing temperature was also demonstrated.
Keywords
II-VI semiconductors; Schottky barriers; carrier mobility; current density; gold; nanowires; semiconductor-metal boundaries; thermal conductivity; wide band gap semiconductors; zinc compounds; Joule heating; Schottky contacts; ZnO-Au; carrier transport simulation; current crowding; full 3D model; heating effects; high current density distribution; local temperature breakdown; metal-semiconductor interface; thermal conductivity; thermal transport; zinc oxide nanowires-end-bonded metal contacts; Charge carrier processes; Gold; Heating; Nanowires; Proximity effects; Solid modeling; Zinc oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Devices & Microsystems (ASDAM), 2014 10th International Conference on
Conference_Location
Smolenice
Print_ISBN
978-1-4799-5474-2
Type
conf
DOI
10.1109/ASDAM.2014.6998695
Filename
6998695
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