DocumentCode :
1785515
Title :
Decomposition of equal/unequal length coupled interconnect step response with separate RC, LC, and RL behaviors
Author :
Mehri, Milad ; Masoumi, Nasser
Author_Institution :
Adv. VLSI Lab., Univ. of Tehran, Tehran, Iran
fYear :
2014
fDate :
20-22 May 2014
Firstpage :
290
Lastpage :
295
Abstract :
In this paper a simple method is proposed to separate and extract the output response of two RLC coupled unequal/equal length interconnects, considering electromagnetic coupling with RC, LC, and RL behaviors. The wire is separated in three parts, including RC, RL, and LC mode of operation. The output response is a combination of these three parts. All the results are comprised with data extracted using W-Model of HSPICE. By the proposed results, the designer can understand that the wire response can be estimated by separate RC, RL, or LC lumped segment and define which part is significant in overall behavior. Also the unequal length wires are studied with scattering parameters. For printed circuit board wire dimensions, most of the traces have unequal length. For these wires the coupling parts are modeled by simple segmented model. We considered that the length and origin of the coupled wires varies. In these cases, when the Quasi-TEM approximation is no more valid, S-parameters should be employed for adjacent wires crosstalk and reflection estimation. We conclude that even for the frequency ranges of 15GHz the RLC segmentation model is accurate for interconnect in printed circuit board scale wiring.
Keywords :
crosstalk; electromagnetic coupling; electromagnetic interference; printed circuit interconnections; HSPICE W-Model; LC operation mode; RC operation mode; RL operation mode; RLC coupled unequal interconnect; RLC equal length interconnect; S-parameters; adjacent wires crosstalk; coupled interconnect step response; electromagnetic coupling; electromagnetic wave reflection; lumped segment; output response; printed circuit board scale wiring interconnect; quasiTEM approximation; segmented model; Accuracy; Capacitance; Couplings; Integrated circuit interconnections; Mathematical model; Simulation; Wires; Crosstalk Noise Waveform; Inductive and Capacitive Coupling; Partially Coupled; VLSI Interconnect;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Engineering (ICEE), 2014 22nd Iranian Conference on
Conference_Location :
Tehran
Type :
conf
DOI :
10.1109/IranianCEE.2014.6999550
Filename :
6999550
Link To Document :
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