DocumentCode :
1785784
Title :
Composition profiles in InP/InAsP quantum well structures under the effect of reactives gases during dry etching processes — Luminescence and SIMS
Author :
Landesman, Jean-Pierre ; Jimenez, Joaquin ; Hortelano, Vanesa ; Leger, Y. ; Folliot, Herve ; Delhaye, Thomas ; TORRES, ABEL ; Rhallabi, Ahmed
Author_Institution :
Inst. de Phys. de Rennes, Univ. Rennes 1, Rennes, France
fYear :
2014
fDate :
11-15 May 2014
Firstpage :
1
Lastpage :
2
Abstract :
We have investigated the effects of reactive gases used during the deep reactive ion etching process of InP-based photonic structures in an inductively-coupled plasma (ICP) reactor. Samples with a specific structure, including 9 InAsP/InP quantum wells (QW) with graded As/P composition, were designed. Different chlorine-based gas chemistries were tested. Characterization was performed using cathodo-Iuminescence (CL) and photo-luminescence (PL) at different temperatures, and secondary ion mass spectrometry (SIMS). The luminescence lines display a blue shift upon exposure to the reactive gases, and a strong spectral sharpening. We discuss the influence of Cl diffusion and thermal processes during etching on these modifications.
Keywords :
III-V semiconductors; cathodoluminescence; diffusion; indium compounds; photoluminescence; plasma materials processing; secondary ion mass spectra; semiconductor quantum wells; spectral line shift; sputter etching; Cl diffusion; InP-InAsP; InP-InAsP quantum well structures; InP-based photonic structures; SIMS; blue shift; cathodoIuminescence; chlorine-based gas chemistries; composition profiles; deep reactive ion etching process; dry etching processes; graded As-P composition; inductively-coupled plasma reactor; luminescence lines; photoluminescence; reactives gas effect; secondary ion mass spectrometry; spectral sharpening; thermal processes; Dry etching; Gases; Indium phosphide; Iterative closest point algorithm; Luminescence;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials (IPRM), 26th International Conference on
Conference_Location :
Montpellier
Type :
conf
DOI :
10.1109/ICIPRM.2014.6880554
Filename :
6880554
Link To Document :
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