DocumentCode :
1787024
Title :
Thermal-sustainable power budgeting for dynamic threading
Author :
Xing Hu ; Yi Xu ; Jun Ma ; Guoqing Chen ; Yu Hu ; Yuan Xie
Author_Institution :
State Key Lab. of Comput. Archit., Inst. of Comput. Technol., Beijing, China
fYear :
2014
fDate :
1-5 June 2014
Firstpage :
1
Lastpage :
6
Abstract :
As technology scales, thermal management for multi-core architectures becomes a critical challenge due to increased power density and higher integration density. Existing power budgeting techniques focus on maximizing performance under a given power budget by optimizing the core dynamics. However, in multi-core era, a chip-wide power budget is not sufficient to ensure thermal constraints because the thermal sustainable power capacity varies with different threading strategies and core configurations. In this paper, we propose a model which estimates the thermal sustainable power capacity considering these two run-time factors. The model converts the thermal effect of threading strategies and core configurations into power capacity, which provides a context-based power budget for the power budgeting. Based on this model, we introduce a power budgeting framework aiming to optimize the performance within thermal constraints, named as TSocket. Compared to the chip-wide power budgeting solution, TSocket shows 19% of performance improvement for the PARSEC benchmarks by reducing thermal violations and providing extra power budget for performance improvement.
Keywords :
microprocessor chips; multiprocessing systems; thermal management (packaging); PARSEC benchmarks; TSocket; context-based power budget; core dynamics; dynamic threading; higher integration density; multi-core architectures; power density; thermal effect; thermal management; thermal sustainable power capacity; thermal violations; thermal-sustainable power budgeting; Estimation; Instruction sets; Multicore processing; Semiconductor device measurement; Temperature measurement; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (DAC), 2014 51st ACM/EDAC/IEEE
Conference_Location :
San Francisco, CA
Type :
conf
Filename :
6881514
Link To Document :
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