Title :
A systematic approach for analyzing and optimizing cell-internal signal electromigration
Author :
Posser, Gracieli ; Mishra, Vivekanand ; Jain, Paril ; Reis, R. ; Sapatnekar, Sachin S.
Author_Institution :
Univ. Fed. do Rio Grande do Sul - PPGC, Porto Alegre, Brazil
Abstract :
Electromigration (EM) in on-chip metal interconnects is a critical reliability failure mechanism in nanometer-scale technologies. This work addresses the problem of EM on signal interconnects within a standard cell. An approach for modeling and efficient characterization of cell-internal EM is developed, incorporating Joule heating effects, and is used to analyze the lifetime of large benchmark circuits. Further, a method for optimizing the circuit lifetime using minor layout modifications is proposed.
Keywords :
electromigration; integrated circuit interconnections; integrated circuit layout; integrated circuit reliability; nanofabrication; Joule heating effect; cell-internal signal electromigration; circuit lifetime optimization; minor layout modification; nanometer-scale technology; on-chip metal interconnects; reliability failure mechanism; Current density; Discharges (electric); Layout; Libraries; Metals; Switches; Wires;
Conference_Titel :
Computer-Aided Design (ICCAD), 2014 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
DOI :
10.1109/ICCAD.2014.7001395
