Determining copper surface change ratio of conduction path by using image processing

Copper is a decisive component in electronic devices and conduction paths of printed circuits. The copper changes during electrical stress pulses. The surface can melt up as well as cracks and voids can develop inside the copper specimen. We investigate how the copper surface changes during a sequence of electrical stress pulses. The copper surface is recorded by a high speed camera. Image processing techniques are required to determine and compute the changes of the surface structure. In the proposed paper, we illustrate a procedure of image processing techniques to improve and align the raw data images. Image differencing is used to determine temporal changes in the images leading to the copper surface change ratio, which is indicative of the information we seek.