Title :
Numerical Study of Overheat Fault in Copper Wire Caused by Bad Contact Base on Multi-physics Coupling
Author :
Wen-bing Yang ; Shan-Jun Mo ; Dong Liang ; Fang-Jie Zhen
Author_Institution :
Sch. of Eng., Sun Yat-sen Univ., Guangzhou, China
Abstract :
It is of great significance to study heating mechanism of bad contact wire since its high risk of fire. This is a problem of multi-physics coupling, which refer to electric and temperature field. A numerical coupling model is introduced in this paper to describe the overheat fault caused by bad contact in HPDE insulated copper wire base on COMSOL Multiphysics software. The heating effect on the fatigue fracture surface is taken into account, which is affected by the current density, contact area, contact resistance and thermal expansion coefficient, etc.
Keywords :
copper; electrical contacts; fault diagnosis; heating; numerical analysis; polyethylene insulation; wires (electric); COMSOL Multiphysics software; HPDE insulated copper wire; bad contact wire; contact area; contact resistance; copper wire; current density; electric field; fatigue fracture surface; heating effect; heating mechanism; multiphysics coupling; numerical coupling model; overheat fault; temperature field; thermal expansion coefficient; Contacts; Copper; Heating; Surface cracks; Surface resistance; Temperature distribution; Wires; Bad contact; COMSOL Multiphysics; Copper wire; Multi-physics;
Conference_Titel :
Intelligent Computation Technology and Automation (ICICTA), 2014 7th International Conference on
Conference_Location :
Changsha
Print_ISBN :
978-1-4799-6635-6
DOI :
10.1109/ICICTA.2014.103
