DocumentCode
1791492
Title
Study of on-chip vias of resonant rotary traveling wave oscillators
Author
Figueroa, Javier Osorio ; Linares Aranda, Monico
Author_Institution
Inst. Nac. de Astrofis. Opt. y Electron. (INAOE), Tonantzintla, Mexico
fYear
2014
fDate
6-8 Oct. 2014
Firstpage
157
Lastpage
158
Abstract
The accelerated increment of operation frequencies in integrated circuits (ICs) in sub-micron technologies above GHz, makes that conventional clock signal distribution networks (H and X trees, spine, etc.) become obsolete due to the large number of lines and buffers that conform them, making them to have a high power consumption as well as high uncertainty time in the arrival of the clock signals to the sinks (registers, gates, blocks, etc.). Therefore, there have been sought alternatives capable to distribute clock signals with a reduced power consumption and minimum uncertainty in time (skew and jitter). The resonant networks are an excellent choice, since they take advantage of the parasitic elements (capacitances and inductances) present in transmission lines to generate oscillations, whereby, they are able to distribute clock signals at the same time that generate them; this causes the power consumption in these structures is less than for conventional networks [1]. One of the most promising resonant structure is the Rotary Traveling Wave Oscillator (RTWO), which is formed by a closed loop and a mobius termination to recirculate the energy as shown in [2]. Although these resonant structures have been extensively studied in recent years, few papers like [3] have focused on study the impact of the different physical shapes of these networks, such as the folds of the resonant ring, the spacing between lines that transport the signal (odd mode differential transmission lines), and the widths thereof.
Keywords
integrated circuits; oscillators; transmission lines; travelling wave tubes; H trees; IC; RTWO; X trees; clock signal distribution networks; closed loop; integrated circuits; mobius termination; odd mode differential transmission lines; on-chip vias; operation frequencies; parasitic elements; physical shapes; power consumption; power consumption reduction; resonant ring; resonant rotary traveling wave oscillators; resonant structures; spine; submicron technologies; Clocks; Metals; Oscillators; Power demand; Registers; Resonant frequency; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Very Large Scale Integration (VLSI-SoC), 2014 22nd International Conference on
Conference_Location
Playa del Carmen
Type
conf
DOI
10.1109/VLSI-SoC.2014.7004165
Filename
7004165
Link To Document