• DocumentCode
    1792094
  • Title

    Modeling and simulation of electrostatic attraction force for climbing robots on the conductive wall material

  • Author

    Jiubing Mao ; Lan Qin ; Yong Wang ; Jun Liu ; Lian Xue

  • Author_Institution
    Key Lab. of Optoelectron. Technol. & Syst. of Minist. of Educ., Univ. of Chongqing, Chongqing, China
  • fYear
    2014
  • fDate
    3-6 Aug. 2014
  • Firstpage
    987
  • Lastpage
    992
  • Abstract
    Electrostatic adhesion technology having good application prospects on wall climbing robots has been extensively investigated in recent years. In this paper, an accurate analytical model that is derived from ideal the parallel-plate capacitor consisting of two different dielectric layers in series has been developed by the Maxwell stress tensor formulation for the electrostatic attraction force between a conductive material wall and the flexible electrodes pad. The analytical model of the adhesion force is verified through comparing the calculation results with the simulation data by the ANSYS finite element technique. And the computation results are demonstrated to be good agreement with the simulation data. The parameters such as electrodes geometrical properties, applied high voltage magnitude and so on, affect the electrostatics adhesion force also been revealed in this paper.
  • Keywords
    adhesion; capacitors; conducting materials; electrostatics; finite element analysis; mobile robots; robot dynamics; tensors; ANSYS finite element technique; Maxwell stress tensor formulation; climbing robots; conductive material wall; dielectric layers; electrodes geometrical properties; electrostatic attraction force; electrostatics adhesion force; flexible electrodes pad; high voltage magnitude; parallel-plate capacitor; Adhesives; Capacitors; Electrodes; Electrostatics; Force; Materials; Electrostatic adhesion force; plate capacitor; wall climbing robot;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation (ICMA), 2014 IEEE International Conference on
  • Conference_Location
    Tianjin
  • Print_ISBN
    978-1-4799-3978-7
  • Type

    conf

  • DOI
    10.1109/ICMA.2014.6885832
  • Filename
    6885832