Research on the method of detecting ultrasonic bonding fault

This paper proposes a kind of way to detect ultrasonic bonding without wire according to the method existed. Collect the electrical signal of the ultrasonic transducer through the chip named STM32 without using other sensor. Through the statistical method, it builds the model of the noise according to the detection system. It proposes a method which is basing on Kalman filter to find out the threshold of the feature, which is in order to improve the adaptability of system. Finally, it prove the feasibility of this method through a large number of experiments.