• DocumentCode
    1792344
  • Title

    Characterization and optimization of a thermal flow sensor on circuit board level

  • Author

    Glatzl, Thomas ; Steiner, H. ; Kohl, F. ; Sauter, T. ; Keplinger, F.

  • Author_Institution
    CISS, Danube Univ. Krems, Wiener Neustadt, Austria
  • fYear
    2014
  • fDate
    16-19 Sept. 2014
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    The characterization and optimization of a low-cost thermal flow sensor optimized for the use in heating ventilating and air conditioning (HVAC) systems is presented. The fabrication of the transducer is exclusively based on printed circuit board technology to keep costs low and allow for easy handling and replacement. The measurement principle utilizes a calorimetric principle with thermoresistive heat transfer. The thermistors form a Wheatstone bridge while the heating element is supplied with a constant current. The AC bridge output voltage is a function of the flow offering adequate sensitivity and a suitable measurement range for HVAC systems. The main experiments focus on flow measurements with a Lock-In amplifier technique to evaluate the measurement range and sensitivity. Based on prior results for time constants, output voltage, sensitivity, etc., the sensor design has been optimized.
  • Keywords
    HVAC; amplifiers; bridge circuits; calorimetry; flow measurement; flow sensors; heat transfer; optimisation; printed circuits; temperature measurement; temperature sensors; thermistors; transducers; AC bridge output voltage; HVAC system; Wheatstone bridge; calorimetric principle; flow measurement; heating ventilating and air conditioning system; lock-in amplifier technique; optimization; printed circuit board technology; thermal flow sensor; thermistor; thermoresistive heat transfer; transducer; Bridge circuits; Electrical resistance measurement; Heating; Resistance; Sensors; Transducers; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Technology and Factory Automation (ETFA), 2014 IEEE
  • Conference_Location
    Barcelona
  • Type

    conf

  • DOI
    10.1109/ETFA.2014.7005101
  • Filename
    7005101