Title :
Chip-scale-packaging applied to optical transceivers
Author :
Ahadian, J. ; Kusumoto, K. ; Bachta, Paul ; Wong, Man ; Pommer, D. ; Hagan, R. ; Lenos, H. ; Skendzic, Sandra ; Kuznia, C.
Author_Institution :
Ultra Commun., Inc., Vista, CA, USA
Abstract :
We discuss the application chip-scale packaging to create compact transceivers. Low-cost is achieve with wafer-scale packaging and a minimum sub-component count. These small solderable components offer increased density and PCB placement flexibility for optical interconnects.
Keywords :
optical fabrication; optical interconnections; optical transceivers; printed circuits; wafer level packaging; PCB placement flexibility; chip-scale-packaging; compact transceivers; minimum subcomponent count; optical interconnects; optical transceivers; small solderable components; wafer-scale packaging; High-speed optical techniques; Lenses; Optical receivers; Optical transmitters; Packaging; Vertical cavity surface emitting lasers;
Conference_Titel :
Optical Interconnects Conference, 2014 IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4799-2467-7
DOI :
10.1109/OIC.2014.6886093
