• DocumentCode
    1792526
  • Title

    LTB-3D conference committee

  • fYear
    2014
  • fDate
    15-16 July 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Provides a listing of current committee members and society officers.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
  • Conference_Location
    Tokyo, Japan
  • Print_ISBN
    978-1-4799-5260-1
  • Type

    conf

  • DOI
    10.1109/LTB-3D.2014.6886138
  • Filename
    6886138
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1792526