• DocumentCode
    1792538
  • Title

    Copper-to-dielectric heterogeneous bonding for 3D integration

  • Author

    Wei Lin ; Juntao Li ; Washington, Joseph ; Rath, David ; Skordas, Spyridon ; Kirihata, Toshiaki ; Winstel, Kevin ; Peethala, Brown ; Demarest, J. ; Da Song ; Edelstein, D. ; Iyer, Srikrishna

  • Author_Institution
    Int. Bus. Machines, Albany Nanotech, Albany, NY, USA
  • fYear
    2014
  • fDate
    15-16 July 2014
  • Firstpage
    6
  • Lastpage
    6
  • Abstract
    A novel hybrid bonding process has been developed that achieved a successful copper/SiO2 heterogeneous bonding.
  • Keywords
    copper; dielectric materials; integrated circuit bonding; integrated circuit interconnections; metal-insulator boundaries; silicon compounds; three-dimensional integrated circuits; 3D integration; Cu-SiO2; copper-to-dielectric heterogeneous bonding; hybrid bonding process; Bonding; Business; Copper; Manganese; Reliability; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4799-5260-1
  • Type

    conf

  • DOI
    10.1109/LTB-3D.2014.6886145
  • Filename
    6886145
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1792538