Scaling of 3D interconnect technology incorporating metal-metal bonds to pitches of 10 microns and below for infrared focal plane array applications

Author

Temple, D.S. ; Vick, Erik P. ; Lueck, Matthew R. ; Malta, D.

Author_Institution

Electron. & Appl. Phys. Div., RTI Int., Research Triangle Park, NC, USA

fYear

2014

fDate

15-16 July 2014

Firstpage

7

Lastpage

7

Abstract

We will review the status of the implementation of high density area array 3D integration technology relying on low temperature metal-metal bonds in functional infrared imaging systems, and will discuss scaling of the technology for compatibility with readout integrated circuits for focal plane arrays with 10 micron and smaller pixels. Future research needs in this rapidly growing application area will be identified.

Keywords

focal planes; integrated circuit interconnections; readout electronics; three-dimensional integrated circuits; 3D interconnect technology; functional infrared imaging systems; high density area array 3D integration technology; infrared focal plane array applications; low temperature metal-metal bonds; readout integrated circuits; Arrays; Bonding; Integrated circuit interconnections; Scanning electron microscopy; Three-dimensional displays;

fLanguage

English

Publisher

ieee

Conference_Titel

Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on

Conference_Location

Tokyo

Print_ISBN

978-1-4799-5260-1

Type

conf

DOI

10.1109/LTB-3D.2014.6886146

Filename

6886146