Carbon nanotube bump interconnect for flexible multilayer substrates

Author

Fujino, Masahisa ; Terasaka, Haruo ; Suga, Takashi

Author_Institution

Sch. of Eng., Univ. of Tokyo, Tokyo, Japan

fYear

2014

fDate

15-16 July 2014

Firstpage

23

Lastpage

23

Abstract

Bump shaped Vertically Aligned Carbon Nanotubes as bump interconnect structures was fabricated and located on flexible substrates for flexible multilayer substrates. These structures were bonded and transferred by means of surface activated bonding method. In this paper, the fabrication process and electrical and mechanical properties of these structures is reported.

Keywords

bending; carbon nanotubes; electrical resistivity; flexible electronics; integrated circuit interconnections; nanoelectronics; nanofabrication; sputter etching; three-dimensional integrated circuits; wafer bonding; C; bump shaped vertically aligned carbon nanotubes; carbon nanotube bump interconnect structures; electrical properties; fabrication process; flexible multilayer substrates; mechanical properties; surface activated bonding method; Bonding; Carbon nanotubes; Integrated circuit interconnections; Nonhomogeneous media; Substrates; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on

Conference_Location

Tokyo

Print_ISBN

978-1-4799-5260-1

Type

conf

DOI

10.1109/LTB-3D.2014.6886162

Filename

6886162