• DocumentCode
    1792582
  • Title

    Room temperature bonding of sapphire with sapphire or metal substrates in Air using Au films

  • Author

    Ishii, M. ; Kon, Hiroyuki ; Uomoto, M. ; Nakaya, T. ; Shimatsu, T.

  • Author_Institution
    Namiki Precision Jewel Co., Ltd., Yuzawa, Japan
  • fYear
    2014
  • fDate
    15-16 July 2014
  • Firstpage
    27
  • Lastpage
    27
  • Abstract
    Room temperature bonding of sapphire-sapphire and sapphire-metal substrates was achieved in Air using Au films. This bonding technique can support expansion of the potential applications of sapphire in diverse industries.
  • Keywords
    gold; metallic thin films; sapphire; substrates; wafer bonding; Al2O3; Au; gold films; room temperature bonding; sapphire-metal substrates; sapphire-sapphire substrates; temperature 293 K to 298 K; Bonding; Educational institutions; Films; Gold; Steel; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4799-5260-1
  • Type

    conf

  • DOI
    10.1109/LTB-3D.2014.6886166
  • Filename
    6886166
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1792582