• DocumentCode
    1792615
  • Title

    Room-temperature vacuum packaging using ultrasonic bonding with Cu compliant rim

  • Author

    Takigawa, Ryo ; Kawano, Hiroyuki ; Shuto, Takanori ; Ikeda, Akihiro ; Takao, Tomoaki ; Asano, Takashi

  • Author_Institution
    Grad. Sch. of Inf. Sci. & Electr. Eng., Kyushu Univ., Fukuoka, Japan
  • fYear
    2014
  • fDate
    15-16 July 2014
  • Firstpage
    44
  • Lastpage
    44
  • Abstract
    In this study, we demonstrate room-temperature vacuum sealing by combining Cu compliant rim with ultrasonic assist.
  • Keywords
    copper; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; three-dimensional integrated circuits; ultrasonic bonding; Cu; copper compliant rim; copper interconnection; room-temperature vacuum packaging; temperature 293 K to 298 K; three-dimensional integrated circuits; ultrasonic bonding; Acoustics; Bonding; Films; Glass; Packaging; Scanning electron microscopy; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4799-5260-1
  • Type

    conf

  • DOI
    10.1109/LTB-3D.2014.6886183
  • Filename
    6886183
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1792615