DocumentCode
1792617
Title
In-situ observation of ultrasonic bonding using high speed camera
Author
Shuto, Takanori ; Asano, Takashi
Author_Institution
Grad. Sch. of Inf. Sci. & Electr. Eng., Kyushu Univ., Fukuoka, Japan
fYear
2014
fDate
15-16 July 2014
Firstpage
45
Lastpage
45
Abstract
Room-temperature microjoining in the air ambient has been achieved by using cone-shaped Au bump with ultrasonic application. In-situ observation of the ultrasonic bonding is performed using a high speed camera for the purpose of investigating dynamics of the bonding process. “Softening” of the bump under the application of ultrasonic is observed. It is suggested that bonding is almost completed within 100 ms.
Keywords
cameras; gold alloys; ultrasonic bonding; Au; air ambient; bump softening; cone-shaped gold bump; high speed camera; in-situ observation; room-temperature microjoining; temperature 293 K to 298 K; time 100 ms; ultrasonic bonding process; Gold; Image resolution; Indium gallium arsenide;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location
Tokyo
Print_ISBN
978-1-4799-5260-1
Type
conf
DOI
10.1109/LTB-3D.2014.6886184
Filename
6886184
Link To Document