DocumentCode
1793205
Title
High performance integrated inductors for power management applications
Author
Eshkoli, Ayal ; Bar-Lev, Sharon ; Peled, Gabi ; Nemirovsky, Yael ; Parag, Allon ; Shapira, Shye
Author_Institution
Electr. Eng. Dept., Technion - Israel Inst. of Technol., Haifa, Israel
fYear
2014
fDate
3-5 Dec. 2014
Firstpage
1
Lastpage
5
Abstract
We report here a study on integrated in-package inductors with and without ferrite core for monolithic DC2DC buck converter. The power IC is designed and fabricated with standard 0.18 μm CMOS process and the inductor is fabricated with CMOS 0.18 μm three layers process. Prototype high power (0.6-1.2W) converter in package (SiP) is designed to operate at ~10MHz with optional configuration for higher frequencies.
Keywords
CMOS integrated circuits; DC-DC power convertors; ferrite devices; inductors; magnetic cores; power integrated circuits; system-in-package; CMOS process; ferrite core; integrated in-package inductors; integrated inductors; monolithic DC-DC buck converter; power 0.6 W to 1.2 W; power IC; power management applications; size 0.18 mum; system-in-package; Inductance; Inductors; Magnetic cores; Magnetic hysteresis; Resistance; Spirals; Wires; DC-DC buck converter; core losses; ferrites; frequency dependence of core resistance; inductors; power management integrated circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical & Electronics Engineers in Israel (IEEEI), 2014 IEEE 28th Convention of
Conference_Location
Eilat
Print_ISBN
978-1-4799-5987-7
Type
conf
DOI
10.1109/EEEI.2014.7005731
Filename
7005731
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