DocumentCode
1793475
Title
A path to 300 mm hybrid silicon photonic integrated circuits
Author
Bowers, John E. ; Bovington, J.T. ; Liu, Alan Y. ; Gossard, Arthur C.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of California Santa Barbara, Santa Barbara, CA, USA
fYear
2014
fDate
9-13 March 2014
Firstpage
1
Lastpage
3
Abstract
We describe recent advances in hybrid silicon components and photonic integrated circuits. We present a path towards scalable, ultralow cost photonic integrated circuits (PICs) on 300 mm silicon substrates.
Keywords
elemental semiconductors; integrated optoelectronics; silicon; Si; hybrid silicon components; hybrid silicon photonic integrated circuits; scalable photonic integrated circuits; silicon substrates; size 300 mm; ultralow cost photonic integrated circuits; Epitaxial growth; Gallium arsenide; Optical transmitters; Quantum dot lasers; Silicon photonics; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communications Conference and Exhibition (OFC), 2014
Conference_Location
San Francisco, CA
Print_ISBN
978-1-5575-2994-7
Type
conf
DOI
10.1364/OFC.2014.Th1C.1
Filename
6886644
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