• DocumentCode
    1794494
  • Title

    Taking optics to the chip: From board-mounted optical assemblies to chip-level optical interconnects

  • Author

    Schmidtke, Katharine ; Flens, Frank ; Mahgarefteh, Daniel

  • Author_Institution
    Finisar Corp., Sunnyvale, CA, USA
  • fYear
    2014
  • fDate
    9-13 March 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Board-mounted optical assemblies (BOAs) enable significant bandwidth density increase relative to pluggable optics at the card edge. We discuss the challenges for the next step in this evolution as optics moves towards the chip.
  • Keywords
    integrated optoelectronics; microprocessor chips; optical interconnections; BOA; board-mounted optical assemblies; chip-level optical interconnects; pluggable optics; Assembly; Bandwidth; High-speed optical techniques; Optical fibers; Optical interconnections;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Fiber Communications Conference and Exhibition (OFC), 2014
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-5575-2994-7
  • Type

    conf

  • DOI
    10.1364/OFC.2014.W4I.1
  • Filename
    6887201
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1794494