• DocumentCode
    1794769
  • Title

    Heat dissipation based on LTCC-HTCC heterostructure

  • Author

    Jurcisin, Michal ; Slosarcik, Stanislav ; Kardos, Slavomir

  • Author_Institution
    Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kośice, Slovakia
  • fYear
    2014
  • fDate
    7-11 May 2014
  • Firstpage
    7
  • Lastpage
    10
  • Abstract
    Articles deals with technology of realization of LTCC-HTCC heterostructure based on different thermal conductivity of substrates as well as with fabrication process of inner channels on the interface of heterostructure. In the practical part the results of measurements on realized samples for the purpose of use in field of heat dissipation from electronic microstructures are presented.
  • Keywords
    ceramic packaging; cooling; thermal conductivity; LTCC-HTCC heterostructure; electronic microstructures; heat dissipation; thermal conductivity; Cavity resonators; Conductivity; Cooling; Heating; Substrates; Thermal conductivity; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
  • Conference_Location
    Dresden
  • Type

    conf

  • DOI
    10.1109/ISSE.2014.6887552
  • Filename
    6887552
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1794769