• DocumentCode
    1794782
  • Title

    Analysis of mechanical properties of LTCC substrates

  • Author

    Lukacs, Peter ; Pietrikova, Alena ; Livovsky, Lubomir

  • Author_Institution
    Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
  • fYear
    2014
  • fDate
    7-11 May 2014
  • Firstpage
    39
  • Lastpage
    43
  • Abstract
    In this paper we describe the most commonly used methods for analysis the mechanical properties of 3 types LTCC substrates (DuPont 951, DuPont 9K7, MuRata) based on three- and four-point bending as well as Dynamic Mechanical Analysis (DMA). The results of analysis show that the four-point bend test indicates a distribution of stress in the substrate with more accuracy and points to the tendency of the fracture-toughness state in the material. The three-point bend test achieves higher flexural strength of tested substrates. The re-firing process applied to the LTCC type 951 increases the flexural strength by 10 %. Extension of the duration of the firing process from 4 h to 26.5 h causes increasing the flexural strength by 100 %. This work proves that the Murata has the best homogeneity and the LTCC type 9K7 has the greatest predisposition to brittle fracture at a distance of lower supports of 32 mm. The sintering process´ conditions of the ceramics have the significant influence to the shrinkage of the all tested ceramics´ types. DMA analyses of the ceramics within the elasticity range confirm the described behavior of fracture-toughness state realized by classic test methods.
  • Keywords
    bending; bending strength; brittle fracture; ceramics; elasticity; firing (materials); fracture toughness; shrinkage; sintering; stress-strain relations; substrates; DuPont 951; DuPont 9K7; LTCC substrates; MuRata; brittle fracture; dynamic mechanical analysis; elasticity; firing process; flexural strength; four-point bending; fracture-toughness state; mechanical properties; shrinkage; sintering; three-point bending; time 4 h to 26.5 h; Ceramics; Firing; Microwave filters; Stress; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
  • Conference_Location
    Dresden
  • Type

    conf

  • DOI
    10.1109/ISSE.2014.6887558
  • Filename
    6887558