DocumentCode :
1794795
Title :
Evaluation of the interfacial resistance between carbon nanotube and silicon by using molecular dynamics simulations
Author :
Platek, Bartosz ; Falat, Tomasz ; Felba, Jan
Author_Institution :
Wroclaw Univ. of Technol., Wrocław, Poland
fYear :
2014
fDate :
7-11 May 2014
Firstpage :
70
Lastpage :
74
Abstract :
This paper is aimed to the evaluation of interfacial thermal resistance between carbon nanotube and crystal of silicon by using molecular dynamics simulation. The calculations were executed by implemented algorithm for enforcing the heat flow in the model (PERL script language) in Forcite module of Materials Studio software (Accelrys, Software Inc.). Two models of the interface between carbon nanotube and silicon rod were proposed. The first one was with closed ends of CNT and the second one with opened ends CNT bonded to the silicon.
Keywords :
carbon nanotubes; elemental semiconductors; molecular dynamics method; silicon; thermal conductivity; thermal resistance; C-Si; CNT; Forcite module; carbon nanotube; heat flow; implemented algorithm; interfacial thermal resistance; material studio software; molecular dynamics simulation; silicon rod; Carbon nanotubes; Heating; Kinetic energy; Silicon; Software; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
Type :
conf
DOI :
10.1109/ISSE.2014.6887565
Filename :
6887565
Link To Document :
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