DocumentCode
1794847
Title
Impact of solder paste drying on the solderability
Author
Otahal, A. ; Adamek, M. ; Szendiuch, I.
Author_Institution
Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic
fYear
2014
fDate
7-11 May 2014
Firstpage
198
Lastpage
201
Abstract
This paper deals with the influence of the dried no-clean SAC305 solder paste on the spreading factor. Drying was defined by time between stencil printing and reflow soldering. Main investigated parameter was spreading, which is percentage difference between diameter of circle of solder paste after printing and diameter of circle after soldering.
Keywords
copper alloys; drying; reflow soldering; silver alloys; solders; tin alloys; SnAgCu; dried no-clean SAC305 solder paste; reflow soldering; solder paste drying; solderability; spreading factor; stencil printing; Atmosphere; Materials; Printing; Seminars; Soldering; Springs; Surface finishing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location
Dresden
Type
conf
DOI
10.1109/ISSE.2014.6887592
Filename
6887592
Link To Document