DocumentCode
1794849
Title
Influence of different methods of ageing on microstructure of solder joints
Author
Pietrikova, Alena ; Durisin, J. ; Bazu, M. ; Ilian, V.
Author_Institution
Dept. of Technol. in Electron., Tech. Univ. of Kosice, Kosice, Slovakia
fYear
2014
fDate
7-11 May 2014
Firstpage
202
Lastpage
205
Abstract
An influence of damping heat and thermal cycling on microstructure and microhardness of solder joints was investigated. Solder joints were prepared by vapour phase and hot air reflow soldering. Results of the microstructure analysis show on significant influence of the ageing on propagation of voids and cracks in the bulk of solder joints.
Keywords
ageing; microcracks; microhardness; reflow soldering; damping heat; hot air reflow soldering; solder joint ageing; solder joint microhardness; solder joint microstructure; thermal cycling; vapour phase soldering; Aging; DH-HEMTs; Heating; Joints; Merging; Microstructure; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location
Dresden
Type
conf
DOI
10.1109/ISSE.2014.6887593
Filename
6887593
Link To Document