Acceleration of life prediction of solder joints using multi-failure criteria

Occurring from many years a impetuous growth of electronic devices manufacturing, induced by introducing a new functionalities for customers and moving towards replacing hazardous substances such as lead in electrical and electronic equipment caused that a reliability of solder joints is more important issue in electronic assembly. Reliability of solder joints plays a major role in the electronic packaging. Indeed, the solder joints serve not only for the transmitting of electrical signals, but also for the heat transportation and as a structural support which is one of the most important aspects. Therefore very important is to estimate behavior of solder joints in various work conditions. The best way to solve that problem is to take a focus on creep and fatigue phenomena which initiate degradation process. Currently creep and fatigue phenomena are considered only in self-dependent way. Consequently reliability prototyping is long lasting and expensive. The usual tests take advantage of only one dominating failure mode which can last even for a number of months. In addition all failure analysis are done under the simplified conditions what means that obtained results are not properly reliable. To accelerate that kind of tests creep and fatigue phenomena should be taken into account at the same time [1]. That combination can help to develop analytical, experimental and numerical approach for understanding the combined multi-loading and multi-failure problem. Therefore an appropriate understanding and development of analytical methods and experimental tools for multi-failure criteria analysis could be very helpful. The study will present new method, which allow introduce multi-failure conditions to tested joints.