Title :
Analysis of long-term stability of capacitors embedded in printed circuit boards
Author :
Klossowicz, Adam ; Winiarski, Pawel ; Zawierta, M. ; Steplewski, Wojciech ; Dziedzic, Andrzej
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
Abstract :
This paper presents studies of long-term stability of capacitors embedded in printed circuit boards. Planar capacitors fabricated from FaradFlex dielectric foil with copper plates laminated to FR-4 substrate served as test structures. The dielectric was BaTiO3 ceramic/polymer composition with various fillers and consequently various dielectric constants. Moreover test samples differed in composition thickness and surface size. The investigated capacitors were covered with LDP 2×106 (Laser Drillable Prepreg) protective layers to achieve embedded structures. The behaviour of capacitance as well as dissipation factor was investigated for two values of frequency (1 and 10 kHz) in order to determine their long-term stability. The in-situ accelerated ageing process (capacitance and dissipation factor of test samples performed directly at the ageing conditions) was carried out to perform long-term behaviour analysis. Temperature characteristics both before and after aging process were performed for determination of influence of environmental exposure. Additionally insulation resistance under voltage and temperature stress was monitored and analyzed.
Keywords :
ageing; barium compounds; ceramic capacitors; copper alloys; laminations; life testing; permittivity; polymers; printed circuits; BaTiO3; Cu; FR-4 substrate; FaradFlex dielectric foil; LDP 2×106 protective layers; ceramic-polymer composition; composition thickness; copper plates; dielectric constants; dissipation factor; embedded structures; environmental exposure; fillers; frequency 1 Hz; frequency 10 Hz; in-situ accelerated ageing process; insulation resistance; laser drillable prepreg protective layers; long-term behaviour analysis; long-term stability analysis; planar capacitors; printed circuit boards; surface size; temperature characteristics; temperature stress; test structures; voltage stress; Aging; Capacitance; Capacitors; Insulation; Resistance; Temperature; Thermal stability;
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
DOI :
10.1109/ISSE.2014.6887647