Title :
Demonstration: Quilt packaging for heterogeneous integration of CNN systems
Author :
Bernstein, Gary H. ; Kulick, Johannes
Author_Institution :
Univ. of Notre Dame, Notre Dame, IN, USA
Abstract :
A demonstration is presented at the 14th International Workshop on Cellular Nanoscale Networks and their Applications. The topic is the interchip interconnect technology known as Quilt Packaging™ (QP). QP offers many advantages for future, highly integrated CNN systems. The author will have demonstration materials on hand for inspection and discussion.
Keywords :
chip scale packaging; integrated circuit interconnections; nanoelectronics; CNN systems; QP; cellular nanoscale networks; chip-scale packaging; heterogeneous integration; interchip interconnect technology; quilt packaging; Educational institutions; Fabrication; Indexes; Shape; Chip-scale packaging; Integrated circuit packaging; Micromachining; Semiconductor device packaging; System-in-package;
Conference_Titel :
Cellular Nanoscale Networks and their Applications (CNNA), 2014 14th International Workshop on
Conference_Location :
Notre Dame, IN
DOI :
10.1109/CNNA.2014.6888610
